Sony is preparing to introduce at least one successor to the Xperia XZ1, most likely for the MWC in February. Rumor has it that the company’s next flagship smartphone will eventually adopt the non-bezel style that was so popular in 2017, and a technical data sheet for the Sony H82xx device was released a few days ago. Obviously, this will come in four market-dependent versions: H8216, H8266, H8276 and H8296.
The H8266 has now been detected in the Geekbench database after the known reference point has been executed. The list confirms that at least this model will be equipped with Qualcomm’s Snapdragon 845 technology, the main offering of SoC for the coming year. The Sony H8266 combines with 4GB of RAM and runs on Android 8.0 Oreo.
The phone reached the score of 2393 single-core in Geekbench 4.2 and 8300 in multi-core. These results are in line with what dominates the Galaxy S9 + with the same chipset, and it seems that the 845 in the performance department will not fail.
While Geekbench did not reveal anything about the new Sony, the latest leaks had 64 GB of built-in memory, two 12 MP cameras on the back and a 15 MP frontend. It should continue to be operated with a 3130 mAh battery.